JPH0512207Y2 - - Google Patents
Info
- Publication number
- JPH0512207Y2 JPH0512207Y2 JP1987179536U JP17953687U JPH0512207Y2 JP H0512207 Y2 JPH0512207 Y2 JP H0512207Y2 JP 1987179536 U JP1987179536 U JP 1987179536U JP 17953687 U JP17953687 U JP 17953687U JP H0512207 Y2 JPH0512207 Y2 JP H0512207Y2
- Authority
- JP
- Japan
- Prior art keywords
- spool
- container body
- ridge
- fitting ridge
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987179536U JPH0512207Y2 (en]) | 1987-11-24 | 1987-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987179536U JPH0512207Y2 (en]) | 1987-11-24 | 1987-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0183769U JPH0183769U (en]) | 1989-06-05 |
| JPH0512207Y2 true JPH0512207Y2 (en]) | 1993-03-29 |
Family
ID=31471084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987179536U Expired - Lifetime JPH0512207Y2 (en]) | 1987-11-24 | 1987-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0512207Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58187142U (ja) * | 1982-06-08 | 1983-12-12 | 住友金属鉱山株式会社 | スプ−ルケ−ス |
| JPS6152674U (en]) * | 1984-09-12 | 1986-04-09 |
-
1987
- 1987-11-24 JP JP1987179536U patent/JPH0512207Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0183769U (en]) | 1989-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5115950A (en) | Dispensing closure with unitary structure for retaining a pressure-actuated flexible valve | |
| US4154360A (en) | Overcap and container assembly | |
| US5421469A (en) | Synthetic resin sealing cap for a fluid bottle | |
| US4386702A (en) | Molded foam plastic plate packing box | |
| JPH0512207Y2 (en]) | ||
| JP2679697B2 (ja) | スプールケース | |
| US4761354A (en) | Universal battery post cap | |
| JP3491515B2 (ja) | ボンディングワイヤー用スプールケース | |
| JPH0123465Y2 (en]) | ||
| JPS609183Y2 (ja) | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用容器 | |
| JPH11330140A (ja) | スプールケース | |
| JP3438767B2 (ja) | ボンディングワイヤー用スプールケース | |
| JP3533658B2 (ja) | ボンディングワイヤー用スプールケース | |
| JPH1064991A (ja) | 半導体ウェハ収納容器 | |
| JPH019157Y2 (en]) | ||
| JPS609184Y2 (ja) | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋 | |
| JPH0643569Y2 (ja) | 角形蛇腹体 | |
| JP3470587B2 (ja) | スプールの収納方法およびこれに用いるスプール、スプールケース | |
| JPS5841188Y2 (ja) | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス | |
| JPS6119106Y2 (en]) | ||
| JPH0337342Y2 (en]) | ||
| JPH0315497Y2 (en]) | ||
| JPS609153Y2 (ja) | 補強缶口 | |
| JPS6122849Y2 (en]) | ||
| JPH1159776A (ja) | キャリアテープ |